Patent Assignment
Reel/Frame 051382/0328
Assignment of Assignor's Interest
Recorded: 2019-12-28
Pages: 4
Assignor
LIU, JUN
Executed: 2019-09-16
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
18 GAOXIN 4TH ROAD, EAST LAKE HIGH-TECH DEVELOPMENT ZONE, WUHAN, HUBEI, CHINA
Covered Property
(1)
Methods and Structures for Die-to-Die Bonding