Patent Assignment
Reel/Frame 051388/0697
Assignment of Assignor's Interest
Recorded: 2019-12-30
Pages: 5
Assignors
TSAI, CHING-WEI
Executed: 2019-09-24
HUANG, YU-XUAN
Executed: 2019-09-24
CHENG, KUAN-LUN
Executed: 2019-09-25
WANG, CHIH-HAO
Executed: 2019-09-25
CAO, MIN
Executed: 2019-09-26
CHANG, JUNG-HUNG
Executed: 2019-09-24
CHANG, LO-HENG
Executed: 2019-09-24
WANG, PEI-HSUN
Executed: 2019-11-05
CHIANG, KUO-CHENG
Executed: 2019-09-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Method for Forming the Same