Patent Assignment
Reel/Frame 051389/0628
Assignment of Assignor's Interest
Recorded: 2019-12-30
Pages: 2
Assignor
MORII, TATSUYA
Executed: 2019-12-19
Assignee
DAIHEN CORPORATION
1-11, TAGAWA 2-CHOME, YODOGAWA-KU, OSAKA-SHI, OSAKA, 532-8512, JAPAN
Covered Property
(1)
Impedance Matching Device and Impedance Matching Method