Patent Assignment
Reel/Frame 051395/0561
Assignment of Assignor's Interest
Recorded: 2019-12-31
Pages: 4
Assignors
JHONG, MING-FONG
Executed: 2019-12-30
WANG, CHEN-CHAO
Executed: 2019-12-30
KUO, HUNG-CHUN
Executed: 2019-12-30
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same