Patent Assignment
Reel/Frame 051397/0331
Assignment of Assignor's Interest
Recorded: 2019-12-20
Pages: 4
Assignor
KADOGUCHI, TAKUYA
Executed: 2019-10-17
Assignee
TOYOTA JIDOSHA KABUSHIKI KAISHA
1, TOYOTA-CHO, TOYOTA-SHI, AICHI, 4718571, JAPAN
Covered Property
(1)
Semiconductor Device and Manufacturing Method Thereof with Cu and Sn Intermetallic Compound
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.