Patent Assignment
Reel/Frame 051418/0434
Assignment of Assignor's Interest
Recorded: 2020-01-06
Pages: 6
Assignors
HONG, YI KOAN
Executed: 2019-11-13
KIM, TAESEONG
Executed: 2019-11-13
MOON, KWANGJIN
Executed: 2019-11-13
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Including Through Vias and Methods of Fabricating the Same