Patent Assignment
Reel/Frame 051429/0688
Assignment of Assignor's Interest
Recorded: 2020-01-06
Pages: 4
Assignor
LIU, CHAO WEI
Executed: 2019-12-30
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method of Manufacturing the Same