Patent Assignment
Reel/Frame 051434/0477
Assignment of Assignor's Interest
Recorded: 2020-01-07
Pages: 3
Assignor
YAMAMOTO, TAKASHI
Executed: 2019-10-10
Assignee
SPP TECHNOLOGIES CO., LTD.
KEIDANREN KAIKAN 15F, 3-2 OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-0004, JAPAN
Covered Property
(1)
Wide-Gap Semiconductor Substrate, Apparatus For Manufacturing Wide-Gap Semiconductor Substrate, And Method For Manufacturing Wide-Gap Semiconductor Substrate
Application:
16/629,085 →
Publication:
US 2020/0127090
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.