Patent Assignment
Reel/Frame 051437/0714
Assignment of Assignor's Interest
Recorded: 2020-01-07
Pages: 3
Assignor
DRESCHER, WOLFRAM
Executed: 2019-11-16
Assignee
SILTECTRA GMBH
MANFRED-VON-ARDENNE-RING 7, DRESDEN, 01099, GERMANY
Covered Property
(1)
Method of Producing Stresses in a Semiconductor Wafer