Patent Assignment
Reel/Frame 051442/0463
Assignment of Assignor's Interest
Recorded: 2020-01-07
Pages: 4
Assignors
ZENG, XINRU
Executed: 2019-09-24
CHEN, PENG
Executed: 2019-09-24
ZHOU, HOUDE
Executed: 2019-09-24
Assignee
YANGTZE MEMORY TECHNOLOGIES CO., LTD.
ROOM 7018, NO.18, HUAGUANG BOULEVARD, GUANDONG TECH. INDUSTRIAL PARK, DONGHU DEVELOPMENT AREA, HONGSHAN DISTRICT, WUHAN CITY, HUBEI PROVINCE, CHINA
Covered Property
(1)
Chip Package Structure with Stacked Chips and Manufacturing Method Thereof