Patent Assignment
Reel/Frame 051452/0272
Assignment of Assignor's Interest
Recorded: 2020-01-08
Pages: 5
Assignors
ABHINAND, SAI
Executed: 2019-12-14
SORENSEN, MICHAEL
Executed: 2020-01-06
ELUMALAI, KARTHIK
Executed: 2019-12-18
RAJAPAKSA, DIMANTHA
Executed: 2019-12-18
SUN, CHENG
Executed: 2019-12-14
PAPANU, JAMES S.
Executed: 2020-01-06
MEHTA, GAURAV
Executed: 2020-01-02
PEH, ENG SHENG
Executed: 2020-01-06
THIRUNAVUKARASU, SRI
Executed: 2020-01-06
KORASIDDARAMAIAH, ONKARA
Executed: 2020-01-07
Assignee
APPLIED MATERIALS, INC.
3050 BOWERS AVENUE, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Electrostatic Chuck with Reduced Current Leakage for Hybrid Laser Scribing and Plasma Etch Wafer Singulation Process