Patent Assignment
Reel/Frame 051462/0190
Assignment of Assignor's Interest
Recorded: 2020-01-09
Pages: 2
Assignors
TSAI, CHUN-HSIUNG
Executed: 2019-12-23
MORE, SHAHAJI B.
Executed: 2019-12-24
LIN, YU-MING
Executed: 2019-12-23
WANN, CLEMENT HSINGJEN
Executed: 2019-12-27
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Interconnect Layout for Semiconductor Device