Patent Assignment
Reel/Frame 051472/0536
Assignment of Assignor's Interest
Recorded: 2020-01-09
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2019-12-24
YEH, SUNG-FENG
Executed: 2019-12-24
LIU, TZUAN-HORNG
Executed: 2019-12-24
SHIH, CHAO-WEN
Executed: 2019-12-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package Having Multiple Chips Integrated Therein and Manufacturing Method Thereof