IP Library › Assignment 051502/0872
Patent Assignment
Reel/Frame 051502/0872

Assignment of Assignor's Interest

Recorded: 2020-01-14 Pages: 4
Assignors
KOBAYASHI, HIROSHI
Executed: 2019-12-06
YAMADA, YOSHIHITO
Executed: 2019-12-06
ICHINOSE, AKIHIRO
Executed: 2019-12-06
Assignee
TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
3-1-1 KYOBASHI, CHUO-KU, TOKYO, 104-0031, JAPAN
Covered Property (1)
Ultrasonic Bonding Method
Application: 16/630,875 →
Publication: US 2021/0220940
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Apr 26, 2024
From: TOSHIBA MITSUBISHI-ELECTRIC INDUSTRIAL SYSTEMS CORPORATION
To: TMEIC CORPORATION
Reel/Frame 067244/0359 →