Patent Assignment
Reel/Frame 051561/0519
Assignment of Assignor's Interest
Recorded: 2020-01-21
Pages: 6
Assignors
TAI, CHIH-HSUAN
Executed: 2020-01-02
TSAI, HAO-YI
Executed: 2020-01-02
HUANG, YU-CHIH
Executed: 2020-01-02
CHANG, CHIH-HAO
Executed: 2020-01-06
LIU, CHIA-HUNG
Executed: 2019-12-27
WU, BAN-LI
Executed: 2019-12-30
TSENG, YING-CHENG
Executed: 2019-12-30
LIN, PO-CHUN
Executed: 2020-01-02
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Semiconductor Package and Forming Method Thereof