Patent Assignment
Reel/Frame 051592/0952
Assignment of Assignor's Interest
Recorded: 2020-01-23
Pages: 3
Assignors
JENG, SHIN-PUU
Executed: 2017-09-11
CHEN, SHUO-MAO
Executed: 2017-09-11
HSU, FENG-CHENG
Executed: 2017-09-11
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Chip Package Structure