IP Library › Assignment 051606/0027
Patent Assignment
Reel/Frame 051606/0027

Assignment of Assignor's Interest

Recorded: 2020-01-24 Pages: 4
Assignors
LEE, JAR-WHA
Executed: 2020-01-15
ADAMS, ZACHARY DOUGLAS
Executed: 2020-01-15
MALTESE, MARK ANDREW
Executed: 2019-12-16
Assignee
SYSCOM ADVANCED MATERIALS, INC.
1275 KINNEAR ROAD, COLUMBUS, OHIO, 43212
Covered Properties (2)
Thermal Decomposition Metallization Process
Application: 62/771,814 →
Thermal Decomposition Metallization Process
Application: 16/697,731 →
Publication: US 2020/0165729
Related Assignments (1)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Apr 6, 2026
From: SYSCOM ADVANCED MATERIALS, INC.; SYSCOM TECHNOLOGY, INC.
To: GLENAIR, INC.
Reel/Frame 074287/0041 →