Patent Assignment
Reel/Frame 051606/0741
Assignment of Assignor's Interest
Recorded: 2020-01-24
Pages: 6
Assignors
SHARMA, ABHISHEK
Executed: 2020-01-10
YOO, HUI JAE
Executed: 2020-01-10
LE, VAN H.
Executed: 2020-01-10
SUMBUL, HUSEYIN EKIN
Executed: 2020-01-06
KNAG, PHIL
Executed: 2020-01-06
CHEN, GREGORY K.
Executed: 2020-01-06
KRISHNAMURTHY, RAM
Executed: 2020-01-06
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Multi-Chip Module Having a Stacked Logic Chip and Memory Stack
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.