Patent Assignment
Reel/Frame 051631/0752
Assignment of Assignor's Interest
Recorded: 2020-01-27
Pages: 6
Assignors
LEE, BYUNGJIN
Executed: 2019-10-25
LEE, DONG-SIK
Executed: 2019-10-25
LIM, JOON-SUNG
Executed: 2019-10-25
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Device