Patent Assignment
Reel/Frame 051647/0426
Assignment of Assignor's Interest
Recorded: 2020-01-28
Pages: 10
Assignors
SAKAMOTO, NORIHIKO
Executed: 2019-11-01
YOKOTA, HIROSHI
Executed: 2019-10-30
HASHIMOTO, SHINTARO
Executed: 2019-11-06
NAWATE, KATSUHIKO
Executed: 2019-11-11
TSUCHIKAWA, SHINJI
Executed: 2019-11-06
TAKANEZAWA, SHIN
Executed: 2019-11-01
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Coreless Substrate Prepreg, Coreless Substrate, Coreless Substrate Manufacturing Method and Semiconductor Package
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →