Patent Assignment
Reel/Frame 051653/0981
Assignment of Assignor's Interest
Recorded: 2020-01-29
Pages: 3
Assignor
KAWASHIRO, FUMIYOSHI
Executed: 2020-01-06
Assignees
KABUSHIKI KAISHA TOSHIBA
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
1-1, SHIBAURA 1-CHOME, MINATO-KU, TOKYO, JAPAN
Covered Property
(1)
Semiconductor Device Having an Ultrasonic Bonding Portion Provided Between a Substrate and a Semiconductor Chip