Patent Assignment
Reel/Frame 051662/0141
Assignment of Assignor's Interest
Recorded: 2020-01-29
Pages: 4
Assignors
DELACRUZ, JAVIER A.
Executed: 2020-01-23
ENQUIST, PAUL M.
Executed: 2020-01-25
FOUNTAIN, GAIUS GILLMAN, JR.
Executed: 2020-01-23
MOHAMMED, ILYAS
Executed: 2020-01-23
Assignee
INVENSAS BONDING TECHONOLGIES, INC.
3025 ORCHARD PARKWAY, SAN JOSE, CALIFORNIA, 95134
Covered Property
(1)
Probe Methodology for Ultrafine Pitch Interconnects
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest
Jun 1, 2020
From: ROVI SOLUTIONS CORPORATION; ROVI TECHNOLOGIES CORPORATION; ROVI GUIDES, INC.; TIVO SOLUTIONS INC.
To: BANK OF AMERICA, N.A.
Reel/Frame 053468/0001 →
Change of Name
Nov 19, 2025
From: INVENSAS BONDING TECHNOLOGIES, INC.
To: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
Reel/Frame 073635/0465 →