Patent Assignment
Reel/Frame 051668/0879
Assignment of Assignor's Interest
Recorded: 2020-01-30
Pages: 7
Assignors
CHIANG, HUNG-LI
Executed: 2019-10-25
CHANG, CHIH-SHENG
Executed: 2019-12-25
CHEN, TZU-CHIANG
Executed: 2019-12-25
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Fefet of 3D Structure for Capacitance Matching