Patent Assignment
Reel/Frame 051683/0214
Assignment of Assignor's Interest
Recorded: 2020-01-31
Pages: 4
Assignors
HIRAYAMA, TSUKASA
Executed: 2020-01-30
INADA, TAKAO
Executed: 2020-01-30
HYAKUTAKE, HIRONOBU
Executed: 2020-01-30
KOYAMA, KAZUYA
Executed: 2020-01-30
KAWANO, HISASHI
Executed: 2020-01-30
Assignee
TOKYO ELECTRON LIMITED
3-1 AKASAKA 5-CHOME, MINATO-KU, TOKYO 107-6325, JAPAN
Covered Property
(1)
Substrate Processing Method and Substrate Processing Apparatus