Patent Assignment
Reel/Frame 051686/0432
Assignment of Assignor's Interest
Recorded: 2020-01-31
Pages: 3
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-77, TAIWAN
Covered Property
(1)
Wafer Release Mechanism