Patent Assignment
Reel/Frame 051709/0301
Assignment of Assignor's Interest
Recorded: 2020-02-04
Pages: 7
Assignors
TSAI, MIN-YING
Executed: 2019-12-30
WU, CHENG-TA
Executed: 2019-12-30
TU, YEUR-LUEN
Executed: 2020-01-03
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Conductive Contact for Ion Through-Substrate Via