Patent Assignment
Reel/Frame 051714/0622
Assignment of Assignor's Interest
Recorded: 2020-02-04
Pages: 4
Assignee
SHOWA DENKO K.K.
13-9, SHIBADAIMON 1-CHOME, MINATO-KU, TOKYO, 105-8518, JAPAN
Covered Property
(1)
SiC EPITAXIAL WAFER, AND METHOD OF MANUFACTURING THE SAME
Application:
16/781,294 →
Publication:
US 2020/0251561