Patent Assignment
Reel/Frame 051739/0075
Assignment of Assignor's Interest
Recorded: 2020-02-06
Pages: 8
Assignors
HAN, ILYOUNG
Executed: 2019-10-15
KIM, TAEYEONG
Executed: 2019-10-16
KANG, JIHOON
Executed: 2019-10-15
KWAK, NOHSUNG
Executed: 2019-10-15
KIM, SEOKHO
Executed: 2019-10-17
KIM, HOECHUL
Executed: 2019-10-15
LEE, ILHYOUNG
Executed: 2019-10-15
LEE, HAKJUN
Executed: 2019-10-15
Assignee
SAMSUNG ELECTRONICS CO., LTD.
9, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate Bonding Apparatus