Assignment of Assignor's Interest

Recorded: 2020-02-07 Pages: 5

Assignors

LIU, FU-CHOU

Executed: 2020-02-05

LEE, CHIEN-CHEN

Executed: 2020-02-05

CHANG, YA-HAN

Executed: 2020-02-05

Assignee

KINGPAK TECHNOLOGY INC.

NO.84, TAIHE RD., ZHUBEI CITY, HSINCHU COUNTY, 30267, TAIWAN

Covered Property (1)

Method for Reducing Warpage Occurred to Substrate Strip After Molding Process

Patent: 10,916,511 →

Application: 16/784,299 →

Related Assignments (1)

Other recorded transfers of the patent in this record — the chain of ownership.