Patent Assignment
Reel/Frame 051756/0047
Assignment of Assignor's Interest
Recorded: 2020-02-07
Pages: 6
Assignors
HSU, YING-CHIH
Executed: 2017-05-24
ROTH, ALAN
Executed: 2017-07-20
WANG, CHUEI-TANG
Executed: 2017-05-24
CHANG, CHIH-YUAN
Executed: 2017-05-24
SOENEN, ERIC
Executed: 2017-07-10
CHEN, CHIH-LIN
Executed: 2017-05-24
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Heat Transfer Structures and Methods for Ic Packages