Patent Assignment
Reel/Frame 051767/0095
Assignment of Assignor's Interest
Recorded: 2020-02-10
Pages: 3
Assignors
STEGLICH, PATRICK
Executed: 2020-01-22
MAI, ANDREAS
Executed: 2020-01-17
MAI, CHRISTIAN
Executed: 2020-01-17
Assignee
IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/ LEIBNIZ-INSTITUT FÜR INNOVATIVE MIKROELEKTRONIK
IM TECHNOLOGIEPARK 25, FRANKFURT (ODER), 15236, GERMANY
Covered Property
(1)
Photonic Sensor Chip, Packaged Photonic Sensor Device and Arrangement