Patent Assignment
Reel/Frame 051773/0588
Assignment of Assignor's Interest
Recorded: 2020-02-10
Pages: 4
Assignors
KUNG, CHENG-YUAN
Executed: 2019-11-28
LIN, HUNG-YI
Executed: 2019-11-28
LIN, CHANG-YU
Executed: 2019-11-28
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Packages and Methods of Manufacturing the Same