Semiconductor device packages and methods of manufacturing the same
A semiconductor device package includes a redistribution layer (RDL), a semiconductor device, a transceiver, and a capacitor. The RDL has a first surface and a second surface opposite to the first surface. The semiconductor device is disposed on the first surface of the RDL. The transceiver is disposed on the second surface of the RDL. The capacitor is disposed on the second surface of the RDL. The semiconductor device has a first projected area and the capacitance has a second projected area. The first projected area overlaps with the second projected area.
1. A semiconductor device package, comprising:
a substrate having a first surface and a second surface opposite to the first surface;
a redistribution layer (RDL) disposed on the first surface of the substrate;
a semiconductor device disposed on the RDL;
a transceiver disposed on the second surface of the substrate;
a power supply disposed on the second surface of the substrate; and
an optical fiber engaged with the transceiver,
wherein the power supply is electrically connected to the semiconductor device and the transceiver through the substrate a decoupling capacitor structure disposed on the second surface of the substrate, wherein the decoupling capacitor structure comprises a capacitor electrically connected with the semiconductor device.
2. The semiconductor device package of claim 1 , wherein the semiconductor device has a first projected area, and the power supply has a second projected area, the first projected area overlapping with the second projected area.
3. The semiconductor device package of claim 1 , further comprising a plurality of capacitors and a plurality of inductors disposed on the second surface of the substrate and being surrounding the power supply.
4. The semiconductor device package of claim 3 , wherein the plurality of capacitors and the plurality of inductors regulates an output voltage of the power supply.
5. The semiconductor device package of claim 3 , wherein the capacitors comprises surface mounted device (SMD) capacitors.
6. The semiconductor device package of claim 1 , wherein the power supply provides power to the semiconductor device via the substrate and the RDL.
7. The semiconductor device package of claim 1 , wherein the semiconductor device comprises a multiplexer disposed over the substrate and at least partially overlapping with the transceiver in a vertical direction.
8. The semiconductor device package of claim 7 , wherein an electrical transmission path between the multiplexer and the transceiver is less than 1 cm.
9. The semiconductor device package of claim 1 , further including a decoupling capacitor structure disposed on the second surface of the substrate, wherein the decoupling capacitor structure comprises a capacitor electrically connected with the semiconductor device.
10. The semiconductor device package of claim 9 , wherein the decoupling capacitor structure comprises a first conductive element, wherein the first conductive element connects the capacitor to the RDL.
11. The semiconductor device package of claim 10 , wherein the decoupling capacitor structure further comprises a dielectric layer and a second conductive element, wherein the second conductive element extends through the dielectric layer.
12. The semiconductor device package of claim 1 , further comprising a heat dissipation structure disposed on the semiconductor device, wherein the heat dissipation structure comprises a planar bottom profile.
13. The semiconductor device package of claim 1 , wherein the RDL has a first surface facing away from the substrate and a second surface facing toward the substrate, and wherein a conductive terminal proximal to the first surface of the RDL is finer than a conductive terminal proximal to the second surface of the RDL.
14. The semiconductor device package of claim 1 , wherein the semiconductor device includes a switch processor.
15. The semiconductor device package of claim 1 , further comprising a frame structure, wherein the substrate is supported by the frame structure.
16. The semiconductor device package of claim 1 , further comprising a plurality of multiplexers disposed on the RDL and surrounding the semiconductor device.
17. The semiconductor device package of claim 1 , wherein a power transmission path between the semiconductor device and the power supply is less than 1 cm.
18. The semiconductor device package of claim 1 , wherein the power supply, the plurality of capacitors, and the plurality of inductors consists of a power management circuit.
19. The semiconductor device package of claim 1 , further comprising an optical fiber connector as an interface for the optical fiber to connect with the transceiver.