Patent Assignment
Reel/Frame 051773/0772
Assignment of Assignor's Interest
Recorded: 2020-02-10
Pages: 4
Assignors
LIU, CHANYUAN
Executed: 2019-11-29
LIAO, KUO-HSIEN
Executed: 2019-11-29
CHAN, ALEX CHI-HONG
Executed: 2019-12-17
SHIH, FUH-YUH
Executed: 2019-12-19
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Optical Device Package and Method for Manufacturing the Same