Patent Assignment
Reel/Frame 051789/0624
Assignment of Assignor's Interest
Recorded: 2020-02-11
Pages: 5
Assignors
YAO, CHIEN NING
Executed: 2020-01-31
LEE, KAI-HSUAN
Executed: 2020-02-05
YEONG, SAI-HOOI
Executed: 2020-01-31
LEE, WEI-YANG
Executed: 2020-02-05
CHENG, KUAN-LUN
Executed: 2020-02-04
WANG, CHIH-HAO
Executed: 2020-02-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Finfet Structure with Airgap and Method of Forming the Same