Patent Assignment
Reel/Frame 051791/0371
Assignment of Assignor's Interest
Recorded: 2020-02-12
Pages: 3
Assignors
CHA, KYOUNG JIN
Executed: 2019-12-24
SHIN, WOO CHUL
Executed: 2019-12-24
LEE, SEUNG HEUI
Executed: 2019-12-24
OH, BEOM SEOCK
Executed: 2019-12-24
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Multilayer Electronic Component