Patent Assignment
Reel/Frame 051808/0586
Assignment of Assignor's Interest
Recorded: 2020-02-13
Pages: 5
Assignors
PARK, JUNGSIK
Executed: 2020-02-06
YUN, INKUK
Executed: 2020-02-06
LEE, SUNGHYUP
Executed: 2020-02-06
JUNG, HEESEOK
Executed: 2020-02-06
KWAK, WOONGEUN
Executed: 2020-02-06
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Stack Structure of Printed Circuit Boards Using Interposer and Electronic Device Including the Same