Patent Assignment
Reel/Frame 051816/0984
Assignment of Assignor's Interest
Recorded: 2020-02-13
Pages: 4
Assignors
CHEN, MING-FA
Executed: 2020-01-21
YEH, SUNG-FENG
Executed: 2020-01-21
HONG, JIAN-WEI
Executed: 2020-01-21
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK,, HSINCHU, 300-78, TAIWAN
Covered Property
(1)
Package and Manufacturing Method Thereof