Patent Assignment
Reel/Frame 051824/0006
Assignment of Assignor's Interest
Recorded: 2020-02-14
Pages: 4
Assignors
WU, YOUHONG
Executed: 2020-02-14
SATO, KOJI
Executed: 2020-02-12
KODERA, YOSHIHIRO
Executed: 2020-02-12
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Method for Manufacturing Printed Wiring Board and Printed Wiring Board