IP Library Assignment 051826/0397
Patent Assignment
Reel/Frame 051826/0397

Assignment of Assignor's Interest

Recorded: 2020-02-14 Pages: 3
Assignor
SEDDON, MICHAEL J.
Executed: 2016-07-29
Assignee
SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
5005 EAST MCDOWELL ROAD, MD A700, PHOENIX, ARIZONA, 85008
Covered Property (1)
Thinned Semiconductor Wafer
Application: 16/791,879 →
Publication: US 2020/0185334
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Interest May 13, 2020
From: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 052656/0842 →
Release of Security Interest in Patents Recorded at Reel 052656, Frame 0842 Jun 23, 2023
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC; FAIRCHILD SEMICONDUCTOR CORPORATION
Reel/Frame 064080/0149 →