Patent Assignment
Reel/Frame 051828/0024
Assignment of Assignor's Interest
Recorded: 2020-02-16
Pages: 7
Assignors
KANG, JIN-KYU
Executed: 2019-09-30
JANG, WOOJAE
Executed: 2019-09-30
LEE, CHANGSUB
Executed: 2019-09-30
PARK, SEJUN
Executed: 2019-09-30
LEE, JAEDUK
Executed: 2019-09-30
LEE, JUNG HOON
Executed: 2019-09-30
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Device