Patent Assignment
Reel/Frame 051846/0520
Assignment of Assignor's Interest
Recorded: 2020-02-18
Pages: 5
Assignors
CALO, PAUL ARMAND ASENTISTA
Executed: 2020-01-30
GAN, TEK KEONG
Executed: 2020-01-31
KEH, SER YEE
Executed: 2020-02-03
LEM, TIEN HENG
Executed: 2020-01-31
LIM, FONG
Executed: 2020-01-30
STADLER, MICHAEL
Executed: 2020-01-30
TAY, MEI QI
Executed: 2020-01-31
Assignee
INFINEON TECHNOLOGIES AG
AM CAMPEON 1-15, NEUBIBERG, 85579, GERMANY
Covered Property
(1)
Electrical Interconnect Structure with Radial Spokes for Improved Solder Void Control