Patent Assignment
Reel/Frame 051851/0456
Assignment of Assignor's Interest
Recorded: 2020-02-18
Pages: 4
Assignors
HUNG, YUN-CHING
Executed: 2020-02-14
LIN, YUNG-SHENG
Executed: 2020-02-14
KAO, CHIN-LI
Executed: 2020-02-14
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package and Method for Manufacturing the Same