Patent Assignment
Reel/Frame 051852/0621
Assignment of Assignor's Interest
Recorded: 2019-12-02
Pages: 6
Assignors
AHN, JONGSEON
Executed: 2019-11-05
SIM, JAERYONG
Executed: 2019-11-05
CHUNG, GIYONG
Executed: 2019-11-05
HAN, JEEHOON
Executed: 2019-11-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO,, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 16677, KOREA, REPUBLIC OF
Covered Property
(1)
Three-Dimensional Semiconductor Memory Devices Having Source Structure Overlaps Buried Insulating Layer