Patent Assignment
Reel/Frame 051861/0930
Assignment of Assignor's Interest
Recorded: 2020-02-19
Pages: 5
Assignors
EOM, YONG SUNG
Executed: 2020-02-18
CHOI, KWANG-SEONG
Executed: 2020-02-18
JANG, KI SEOK
Executed: 2020-02-18
MOON, SEOK-HWAN
Executed: 2020-02-18
JOO, JIHO
Executed: 2020-02-18
Assignee
ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
218, GAJEONG-RO, YUSEONG-GU, DAEJEON, 34129, KOREA, REPUBLIC OF
Covered Property
(1)
Method for Manufacturing Semiconductor Package