Patent Assignment
Reel/Frame 051879/0131
Assignment of Assignor's Interest
Recorded: 2020-02-20
Pages: 3
Assignors
PARK, JE SANG
Executed: 2020-02-13
OH, CHANG YUL
Executed: 2020-02-14
JEONG, SANG HO
Executed: 2020-02-13
LEE, YONG DUK
Executed: 2020-02-15
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Substrate with Electronic Component Embedded Therein