Patent Assignment
Reel/Frame 051895/0040
Assignment of Assignor's Interest
Recorded: 2020-02-21
Pages: 6
Assignors
CHIANG, YI WEN
Executed: 2019-12-31
CHEN, KUANG-HSIUNG
Executed: 2019-12-31
LAI, LU-MING
Executed: 2019-12-31
CHAN, HSUN-WEI
Executed: 2019-12-31
HO, HSIN-YING
Executed: 2019-12-31
TANG, SHIH-CHIEH
Executed: 2019-12-31
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Device Package and Method for Manufacturing the Same