Patent Assignment
Reel/Frame 051895/0237
Assignment of Assignor's Interest
Recorded: 2020-02-22
Pages: 5
Assignors
UPPAL, AASTHA
Executed: 2019-10-10
MANI, DIVYA
Executed: 2019-10-10
CHANG, JE-YOUNG
Executed: 2019-10-10
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Embedded Substrate Heat Sink for Bottom Side Cooling