Patent Assignment
Reel/Frame 051899/0741
Assignment of Assignor's Interest
Recorded: 2020-02-24
Pages: 3
Assignors
XU, ZHIJUN
Executed: 2017-10-11
LIU, BIN
Executed: 2017-10-11
SHE, YONG
Executed: 2017-10-11
DING, ZHICHENG
Executed: 2017-10-11
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Power Enhanced Stacked Chip Scale Package Solution with Integrated Die Attach Film