Patent Assignment
Reel/Frame 051908/0294
Assignment of Assignor's Interest
Recorded: 2020-02-24
Pages: 4
Assignors
MALLIK, DEBENDRA
Executed: 2018-07-25
GANESAN, SANKA
Executed: 2018-07-25
LIU, PILIN
Executed: 2018-07-25
LIFF, SHAWNA
Executed: 2018-07-25
CHAVALI, SRI CHAITRA
Executed: 2018-07-26
GAAN, SANDEEP
Executed: 2018-07-25
YAO, JIMIN
Executed: 2018-07-25
UPPAL, AASTHA
Executed: 2018-07-25
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Interposer Package-on-Package (Pop) with Solder Array Thermal Contacts